Stackable integrated circuit package system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8779570
APP PUB NO 20090236731A1
SERIAL NO

12051469

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Abstract

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A stackable integrated circuit package system including mounting an integrated circuit device over a package carrier, mounting a stiffener over the package carrier and mounting a mountable package carrier over the stiffener with a vertical gap between the integrated circuit device and the mountable package carrier.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, TaeWoo Suwon-si, KR 25 248
Kang, Yong Hee Icheon, KR 32 151
Shim, Seong Bo Icheon, KR 7 90

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