Interlevel dielectric stack for interconnect structures
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United States of America Patent
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Jul 15, 2014
Grant Date -
Jul 11, 2013
app pub date -
Jan 5, 2012
filing date -
Jan 5, 2012
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Abstract
A dielectric stack and method of depositing the stack to a substrate using a single step deposition process. The dielectric stack includes a dense layer and a porous layer of the same elemental compound with different compositional atomic percentage, density, and porosity. The stack enhances mechanical modulus strength and enhances oxidation and copper diffusion barrier properties. The dielectric stack has inorganic or hybrid inorganic-organic random three-dimensional covalent bonding throughout the network, which contain different regions of different chemical compositions such as a cap component adjacent to a low-k component of the same type of material but with higher porosity.
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