Stacked semiconductor device with heat dissipation
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United States of America Patent
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Jul 15, 2014
Grant Date -
Mar 28, 2013
app pub date -
Jun 20, 2011
filing date -
Jun 30, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a stacked semiconductor device (50) in which a semiconductor package (5) is stacked via connection terminals (8) on a semiconductor package (1), including a heat dissipating member (10) which is disposed between the semiconductor packages (1, 5), is brought into thermal contact with both of the packages (1, 5), and hangs over whole outer peripheral portions of the package (5). Such a structure causes heat generated from the package (5) to be released by heat dissipation into air above the package (5), heat dissipation into the air below the semiconductor package (5), heat transfer via the heat dissipating member (10) and a semiconductor element (3) to a first wiring substrate (2), heat transfer via the connection terminals (8) to the first wiring substrate (2), and heat dissipation via the heat dissipating member (10) into the air, thereby enhancing a temperature reduction effect of the semiconductor element.
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