Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

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United States of America Patent

PATENT NO 8779605
APP PUB NO 20120326330A1
SERIAL NO

13605621

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Abstract

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A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pratt, David Meridian, US 38 582

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