Load distributed heat sink system
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United States of America Patent
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Jul 15, 2014
Grant Date -
Jun 13, 2013
app pub date -
Dec 12, 2011
filing date -
Dec 12, 2011
priority date (Note) -
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Abstract
The invention provides a load distributed heat sink system for securing a heat sink to a heat-generating electronic component while distributing the load on the circuit board. Provided is a heat sink system having heat sink, a heat sink clip, and a circuit board. The heat sink is generally disposed on one side of the circuit board over a component, and the heat sink clip is generally disposed on the opposing side of the circuit board. The ends of heat sink clip reach to the other side and attach onto the heat sink on. The heat sink clip further includes a load spreader, which is urged onto the circuit board by the heat sink clip, both retaining the heat sink system in place and distributing load on the circuit board.
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