Memory devices having data lines included in top and bottom conductive lines

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8780631
APP PUB NO 20140056049A1
SERIAL NO

13590964

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Abstract

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Some embodiments include apparatuses and methods having a first set of conductive lines, a second set of conductive lines, and memory cells located in different levels of the apparatuses and arranged in memory cell strings. At least a portion of the first set of conductive lines is configured as a first set of data lines. At least a portion of the second set of conductive lines is configured as a second set of data lines. Each of the memory strings is coupled to a respective conductive line in the first set of conductive lines and a respective conductive line in the second set of conductive lines. Other embodiments including additional apparatuses and methods are described.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanzawa, Toru Tokyo, JP 306 5157

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