Heat processing apparatus and heat processing method
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United States of America Patent
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Jul 22, 2014
Grant Date -
Sep 29, 2011
app pub date -
Jun 7, 2011
filing date -
Jan 25, 2006
priority date (Note) -
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Abstract
A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.
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