System and method for dual-sided sputter etch of substrates

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United States of America Patent

PATENT NO 8784622
APP PUB NO 20090145881A1
SERIAL NO

12329447

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Abstract

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A system is provided for etching patterned media disks. A movable non-contact electrode is utilized to perform sputter etch. The electrode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The material to be etched may be metal, e.g., Co/Pt/Cr or similar metals. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched. An isolation valve is disposed between the two chambers and the disk carrier moves the disks between the chambers. The carrier may be a linear drive carrier, using, e.g., magnetized wheels and linear motors.

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Patent Owner(s)

  • INTEVAC, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barnes, Michael S San Ramon, US 73 3654
Bluck, Terry Santa Clara, US 84 2282

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