Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same method

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United States of America Patent

PATENT NO 8784973
APP PUB NO 20120140335A1
SERIAL NO

13396488

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Abstract

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A resin bonding method according to the present invention is a resin bonding method for bonding a first resin and a second resin including (I) a step of irradiating spaces containing oxygen molecules with vacuum ultraviolet light having a wavelength of 175 nm or less, the spaces being in contact with surfaces of the first and second resins; and (II) a step of, after the irradiation, subjecting the surfaces to temperature rise while the surfaces are in contact with each other, to bond the first resin and the second resin together with the surfaces serving as bonding surfaces. In the step (I), the surfaces of the first and second resins may be further irradiated with the vacuum ultraviolet light. In this case, a light amount of the vacuum ultraviolet light having reached the surfaces is preferably, for example, 0.1 J/cm2 or more and 10 J/cm2 or less.

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Patent Owner(s)

Patent OwnerAddress
ALPS ALPINE CO LTD1-7 YUKIGAYA-OTSUKAMACHI OTA-KU TOKYO 1458501 ?1458501

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sugimura, Hiroyuki Kyoto-fu, JP 29 404
Taguchi, Yoshihiro Miyagi-ken, JP 33 85
Taniguchi, Yoshinao Miyagi-ken, JP 7 14

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