Moisture barrier layer dielectric for thermoformable circuits
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United States of America Patent
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Jul 22, 2014
Grant Date -
Jul 10, 2014
app pub date -
Jan 8, 2013
filing date -
Jan 8, 2013
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Abstract
This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver above it and the polycarbonate substrate below it in capacitive switch applications.
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