Strained Ge-on-insulator structure and method for forming the same

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United States of America Patent

PATENT NO 8786017
APP PUB NO 20120228707A1
SERIAL NO

13263222

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Abstract

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A strained Ge-on-insulator structure is provided, comprising: a silicon substrate, in which an oxide insulating layer is formed on a surface of the silicon substrate; a Ge layer formed on the oxide insulating layer, in which a first passivation layer is formed between the Ge layer and the oxide insulating layer; a gate stack formed on the Ge layer, a channel region formed below the gate stack, and a source and a drain formed on sides of the channel region; and a plurality of shallow trench isolation structures extending into the silicon substrate and filled with an insulating dielectric material to produce a strain in the channel region. Further, a method for forming the strained Ge-on-insulator structure is also provided.

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Patent Owner(s)

  • TSINGHUA UNIVERSITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Guo, Lei Beijing, CN 240 1488
Wang, Jing Beijing, CN 1503 11315
Xu, Jun Beijing, CN 913 6867

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