Passivation layer surface topography modifications for improved integrity in packaged assemblies

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United States of America Patent

PATENT NO 8786059
APP PUB NO 20120228748A1
SERIAL NO

13468223

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Abstract

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A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blander, Alexandre Bromont, CA 7 35
Casey, Jon A Poughkeepsie, US 63 960
Daubenspeck, Timothy H Colchester, US 147 1759
Melville, Ian D Highland, US 42 338
Muncy, Jennifer V Ridgefield, US 16 164
Paquet, Marie-Claude Bromont, CA 19 64

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