Liquid cooling system for stackable modules in energy-efficient computing systems
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United States of America Patent
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Jul 22, 2014
Grant Date -
Jul 26, 2012
app pub date -
Mar 30, 2012
filing date -
May 27, 2010
priority date (Note) -
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Abstract
A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.
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