Stacked device remapping and repair

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United States of America Patent

PATENT NO 8787101
SERIAL NO

13959395

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Abstract

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Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on the same die or a different die. Other embodiments are described.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cowles, Timothy B Boise, US 149 2261
Jeddeloh, Joe M Shoreview, US 74 1631
Keeth, Brent Boise, US 345 10325
LaBerge, Paul A Shoreview, US 112 2924
Manning, Troy A Meridian, US 297 12380
Martin, Chris G Boise, US 69 1885
Rehmeyer, Jim Boise, US 4 81

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