Chip packaging fixture using magnetic field for self-alignment
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United States of America Patent
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Jul 29, 2014
Grant Date -
Oct 27, 2011
app pub date -
Apr 22, 2010
filing date -
Apr 22, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and fixture using magnetic field assisted self-alignment for chip packaging. Typical embodiments include a magnetic device having one or more pole groups, each pole group including two or three poles. Some embodiments provide multiple pole groups arranged in a one or two dimensional pole group array. The poles can build up a self-alignment magnetic field. The structure of fixture is simple and easy to implement. Typical embodiments can greatly reduce chip packaging cost and make packaging more efficient. In accordance with typical embodiments, a chip and a substrate can be self-aligned magnetically regardless of their shapes.
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