Process for preparing, prior to filling, a wafer cornet, cornet thus obtained and installation for implementing the process
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United States of America Patent
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Jul 29, 2014
Grant Date -
Sep 26, 2013
app pub date -
May 23, 2013
filing date -
Apr 9, 2004
priority date (Note) -
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Abstract
Process for preparing a cornet consisting of a substantially conical wafer (22) prior to filing of said cornet with an ice-cream; in order to preserve the crunchy nature of the wafer, the inner wall of the cornet is sprayed with liquid chocolate (23); this chocolate solidifies rapidly in order to form a coating layer for separating the wafer and the ice-cream. The process is characterized in that the inside of the cornet is sprayed with an excess quantity of chocolate to guarantee that no coating-gap zone remains on the inner wall of the wafer, the excess liquid chocolate collecting, under gravity, at the bottom tip of the corner, prior to solidification of said excess, the excess is sucked out of the cornet, subsequent solidification of the coating layer thus making it possible to establish a continuous barrier over the inner wall or the wafer.
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