Multi-layered chemical-mechanical planarization pad
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United States of America Patent
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Jul 29, 2014
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app pub date -
Jan 5, 2010
filing date -
Jan 5, 2009
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Abstract
The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.
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