Device having multiple wire bonds for a bond area and methods thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8791007
APP PUB NO 20130134578A1
SERIAL NO

13306390

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Wire bonds are formed at an integrated circuit device so that multiple wires are bonded to a single bond pad. In a particular embodiment, the multiple wires are bonded by first applying a stud bump to the pad and successively bonding each of the wires to the stud bump. Another stud bump can be placed over the bonded wires to provide additional connection security.

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Patent Owner(s)

  • SPANSION LLC

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Foong, Sally Yin Lye Milpitas, US 3 13
Tan, Gin Ghee Bayan Lepas, MY 7 50
Teoh, Lai Beng Ayer Item, MY 2 2
Tziat, Royce Yeoh Kao Bayan Lepas, MY 2 3

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