Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8791446
APP PUB NO 20140021427A1
SERIAL NO

14039027

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to one embodiment, a semiconductor device includes a substrate and an interconnect region on the substrate. The interconnect region includes a first interconnect having a first contact portion whose plane shape is a ring-like plane shape, a second interconnect disposed below the first interconnect, and a contact electrode passing through the ling-like portion of the first contact portion and electrically connecting the first interconnect and the second interconnect.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishibashi, Yutaka Yokkaichi, JP 41 840

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