Multi-chip light emitting diode modules
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United States of America Patent
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Jul 29, 2014
Grant Date -
May 13, 2010
app pub date -
Nov 7, 2008
filing date -
Nov 7, 2008
priority date (Note) -
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Abstract
A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.
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