Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate

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United States of America Patent

PATENT NO 8791566
APP PUB NO 20120038038A1
SERIAL NO

13259222

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Abstract

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The present invention provides an aluminum nitride substrate and an aluminum nitride circuit board having excellent insulation characteristics and heat dissipation properties and having high strength, a semiconductor apparatus, and a method for manufacturing an aluminum nitride substrate.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA;TOSHIBA MATERIALS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Yoshiyuki Ayase, JP 39 315
Yamaguchi, Haruhiko Yokohama, JP 48 103

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