Integrated circuit packages having redistribution structures
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United States of America Patent
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Jul 29, 2014
Grant Date -
Jul 4, 2013
app pub date -
Sep 11, 2012
filing date -
Dec 30, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package includes a semiconductor chip stack disposed between first and second leads near first and second sides of the package and including a plurality of semiconductor chips, and a redistribution structure disposed on the semiconductor chip stack. At least one semiconductor chip of the semiconductor chip stack includes a plurality of first chip pads disposed near or closer to a third side of the package. The redistribution structure includes a first redistribution pad disposed near or closer to the first side and electrically connected to the first lead, a second redistribution pad disposed near or closer to the second side and electrically connected to the second lead, and a third redistribution pad disposed near or closer to the third side and electrically connected to a first one of the first chip pads and the first redistribution pad.
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