Heat dissipation device and radio frequency module with the same

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United States of America Patent

PATENT NO 8792240
APP PUB NO 20120087090A1
SERIAL NO

13327059

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Abstract

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A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).

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Patent Owner(s)

  • HUAWEI TECHNOLOGIES CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hongliang Shenzhen, CN 29 240
Feng, Taqing Shenzhen, CN 8 37
Hong, Yuping Shenzhen, CN 15 104
Li, Zhijian Kista, CH 24 112
Shi, Jian Kista, CH 106 837

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