Hybrid interconnect structure for performance improvement and reliability enhancement
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United States of America Patent
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Aug 5, 2014
Grant Date -
Aug 29, 2013
app pub date -
Mar 15, 2013
filing date -
Jan 22, 2007
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Abstract
A hybrid interconnect structure (of the single or dual damascene type) is provided in which a dense (i.e., non-porous) dielectric spacer is present on the sidewalls of a dielectric material. More specifically, the structure includes a dielectric material having a conductive material embedded within at least one opening in the dielectric material, wherein the conductive material is laterally spaced apart from the dielectric material by a diffusion barrier, a dense dielectric spacer and, optionally, an air gap. The presence of the dense dielectric spacer results in a hybrid interconnect structure that has improved reliability and performance. Moreover, the hybrid interconnect structure provides for better process control which leads to the potential for high volume manufacturing.
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