Flip chip bonded semiconductor device with shelf
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 5, 2014
Grant Date -
Oct 24, 2013
app pub date -
Jun 14, 2013
filing date -
Dec 28, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The semiconductor device according to the present invention has a planar semiconductor chip having projecting connection terminals provided on one surface thereof. A shelf is provided where a peripheral edge of a surface of the semiconductor chip opposite one surface thereof onto which connection terminals are provided is removed. This makes it possible to secure a larger volume of the fillet portion of the underfill, thereby helping improve the function of preventing the rising up of the excess underfill by providing a shelf in the semiconductor chip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully