Ultra-slim sensor device and manufacturing method thereof
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United States of America Patent
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Aug 5, 2014
Grant Date -
Sep 20, 2012
app pub date -
Mar 12, 2012
filing date -
Mar 16, 2011
priority date (Note) -
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Abstract
An ultra-slim sensor device, comprising: a sensor element; lead wires (or lead frames) connected to the sensor element; a support for protecting the sensor element and the lead wires disposed therein; and upper and lower films disposed on upper and lower sides of the sensor element, the lead wires and the support to insulate them, wherein a thickness of the support is greater than that of the sensor element in order to protect the sensor element and the lead wires from external shocks, and the support gradually becomes thin toward the end thereof such that the upper and lower films come into contact with each other in order to remove a space between the upper and lower films.
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