Mixed mode ligands

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United States of America Patent

PATENT NO 8802448
APP PUB NO 20130030154A1
SERIAL NO

13555484

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Abstract

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Substrates comprising a solid support, a ligand, and a linker comprising at least one C, O, N, or S atom covalently connecting the solid support to the ligand, are disclosed, along with methods of using and making the substrates, and devices including the substrates.

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Patent Owner(s)

  • PALL CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ait-Haddou, Hassan Melville, US 30 115
Haigh, Jonathan Sadberge, GB 98 217
Nochumson, Samuel Pensacola, US 13 344
Onyemauwa, Frank Pace, US 10 16

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