Method of fabricating a semiconductor device having an interposer

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United States of America Patent

PATENT NO 8802494
APP PUB NO 20130109135A1
SERIAL NO

13454972

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Abstract

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The method of fabricating a semiconductor device may include forming a semiconductor die on a substrate, forming an interposer including at least one integrated circuit connected to the semiconductor die on the substrate or on the semiconductor die, and performing encapsulation to surround the semiconductor die and the interposer.

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Patent Owner(s)

Patent OwnerAddress
AMKOR TECHNOLOGY KOREA INC100 AMKOR-RO BUK-GU GWANGJU 61006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Ki Cheol Seoul, KR 5 110
Lee, Choon Heung Seoul, KR 44 1103
Na, Do Hyun Seoul, KR 19 218

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