Integrated circuit packaging system with interconnects and method of manufacture thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8802555
APP PUB NO 20120241931A1
SERIAL NO

13069980

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Abstract

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A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; attaching a circuit end of an internal interconnect to the bonding interconnect, the bonding interconnect between the circuit end and the bond pad; and connecting a lead end of the internal interconnect to the lead.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abinan, Rachel Layda Singapore, SG 7 161
Bathan, Henry Descalzo Singapore, SG 113 950
Camacho, Zigmund Ramirez Singapore, SG 173 1461
Pisigan, Jairus Legaspi Singapore, SG 32 289

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