Integrated circuit packaging system with protective coating and method of manufacture thereof
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United States of America Patent
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Aug 12, 2014
Grant Date -
Apr 7, 2011
app pub date -
Sep 24, 2010
filing date -
Oct 1, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.
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