Electronic device package, electronic device, and electronic apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 12, 2014
Grant Date -
Jan 10, 2013
app pub date -
Jul 2, 2012
filing date -
Jul 4, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package includes a base member and a lid member joined to the base member while forming, between the lid and base members, an internal space which stores an electronic component. A joined section of the base and lid members includes a first welded section formed by joining the base and lid members along an x axis direction using seam welding and a second welded section formed by joining the base and lid members along a y axis direction using the seam welding. In plan view, the first and second welded sections do not overlap each other. An area where an area formed by extending the first welded section in the x axis direction and an area formed by extending the second welded section in the y axis direction overlap each other is located on the outer side with respect to the contour of the lid member.
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