Modeling multi-patterning variability with statistical timing
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United States of America Patent
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Aug 12, 2014
Grant Date -
May 1, 2014
app pub date -
Oct 31, 2012
filing date -
Oct 31, 2012
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Abstract
Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.
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