Method of making an electronic package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8806742
APP PUB NO 20110048795A1
SERIAL NO

12552411

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic package has a cover or lid mounted onto a substrate to enclose an electronic device, and a liquid thermal interface material is subsequently inserted (through dispensing, injection molding or printing through apertures in the cover or lid) between the surface of the electronic device and the cover, and cured to a solid state.

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First Claim

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cohen, Erwin B Essex Junction, US 9 131
Goetz, Martin P Raleigh, US 17 209
Muncy, Jennifer V Hopewell Junction, US 16 164

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