Micro-fluid ejection device and method for assembling a micro-fluid ejection device by a wafer-to-wafer bonding
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United States of America Patent
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Aug 19, 2014
Grant Date -
Jun 21, 2012
app pub date -
Feb 29, 2012
filing date -
Nov 7, 2008
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Abstract
A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.
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