Method of manufacturing liquid ejecting head, piezoelectric element, and liquid ejecting device

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United States of America Patent

PATENT NO 8807710
APP PUB NO 20130229464A1
SERIAL NO

13783841

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Abstract

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A piezoelectric element equipped with a piezoelectric layer and an electrode provided on the piezoelectric layer, comprising the piezoelectric layer, which is made from a complex oxide having a perovskite structure containing Bi, Fe, Ba and Ti, and which has a residual stress of 250 MPa or more, and a method of manufacturing a liquid ejecting head equipped with a piezoelectric layer and an electrode provided on the piezoelectric layer, the method including forming the piezoelectric layer, which is made from a complex oxide having a perovskite structure containing Bi, Fe, Ba and Ti, and which has a residual stress of 250 MPa or more.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nawano, Masahisa Suwa, JP 24 106

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