Producing SiC packs on a wafer plane

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8809180
APP PUB NO 20080128710A1
SERIAL NO

11816186

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Abstract

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A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

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Patent Owner(s)

  • SIEMENS AKTIENGESELLSCHAFT

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Weidner, Karl München, DE 64 324
Weinke, Robert München, DE 8 18

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