Current peak spreading schemes for multiplexed heated array
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United States of America Patent
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Aug 19, 2014
Grant Date -
Oct 17, 2013
app pub date -
Apr 13, 2012
filing date -
Apr 13, 2012
priority date (Note) -
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Abstract
A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.
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