Integrated circuit packaging system with high lead count and method of manufacture thereof
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United States of America Patent
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Aug 19, 2014
Grant Date -
Dec 16, 2010
app pub date -
Jun 14, 2009
filing date -
Jun 14, 2009
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a leadframe with a tiebar and an outer lead having an outer lead outer pad; forming an inner lead on a peel strip; attaching the leadframe to the peel strip around the inner lead; wire bonding a die to the outer lead and the inner lead; encapsulating the die and portions of the outer lead and the inner lead; removing the peel strip to expose a bottom surface of the inner lead; and removing the leadframe to have the outer lead outer pad of the outer lead coplanar with the bottom surface of the inner lead.
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