Integrated circuit package system with stacked die
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United States of America Patent
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Aug 19, 2014
Grant Date -
May 31, 2012
app pub date -
Feb 6, 2012
filing date -
Sep 23, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package system includes a trace frame includes: an encapsulant; a first series of bonding pads along a length of the encapsulant; a second series of the bonding pads along a width of the encapsulant; conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and a first integrated circuit die on the encapsulant and on the conductive traces that extend beyond the first integrated circuit die.
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