Method for manufacturing a coil-type electronic component
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United States of America Patent
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Aug 26, 2014
Grant Date -
Nov 3, 2011
app pub date -
Apr 22, 2011
filing date -
Apr 30, 2010
priority date (Note) -
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Abstract
A coil-type electronic component has a coil inside or on the surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer.
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