Manufacturing apparatus and method for semiconductor device and cleaning method of manufacturing apparatus for semiconductor
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United States of America Patent
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Aug 26, 2014
Grant Date -
Dec 22, 2011
app pub date -
Jun 14, 2011
filing date -
Jun 22, 2010
priority date (Note) -
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Abstract
A manufacturing apparatus for a semiconductor device, including: a reaction chamber configured to perform film formation on a wafer; a process gas supplying mechanism provided in an upper part of the reaction chamber and configured to introduce process gas to an interior of the reaction chamber; a gas discharging mechanism provided in a lower part of the reaction chamber and configured to discharge gas from the reaction chamber; a supporting member configured to hold the wafer; a cleaning gas supplying mechanism provided in an outer periphery of the supporting member and configured to emit cleaning gas in an outer periphery direction below an upper end of the supporting member; a heater configured to heat the wafer; and a rotary driving mechanism configured to rotate the wafer.
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