Terminal structure, printed wiring board, module substrate, and electronic device
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United States of America Patent
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Aug 26, 2014
Grant Date -
Feb 23, 2012
app pub date -
Jul 22, 2011
filing date -
Aug 17, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a terminal structure and an electronic device having the terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; and a third layer containing a first intermetallic compound of an Ni—Cu—Sn type, laid on the second layer; and a solder layer on the third layer of the terminal. A second intermetallic compound of an Ni—P—Sn type partly covers a surface of the second layer on the third layer side and a maximum thickness of the second intermetallic compound in a lamination direction is from 0.05 to 0.7 μm.
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