Integrated circuit structures, semiconductor structures, and semiconductor die
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United States of America Patent
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Aug 26, 2014
Grant Date -
Sep 6, 2012
app pub date -
May 14, 2012
filing date -
Feb 25, 2009
priority date (Note) -
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Abstract
Methods for fabricating integrated circuit devices on an acceptor substrate devoid of circuitry are disclosed. Integrated circuit devices are formed by sequentially disposing one or more levels of semiconductor material on an acceptor substrate, and fabricating circuitry on each level of semiconductor material before disposition of a next-higher level. After encapsulation of the circuitry, the acceptor substrate is removed and semiconductor dice are singulated. Integrated circuit devices formed by the methods are also disclosed.
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