Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 26, 2014
Grant Date -
Nov 8, 2012
app pub date -
May 5, 2011
filing date -
May 5, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus includes a die with through-silicon vias and radio frequency integrated circuit capabilities and it is vertically integrated with a phased-array antenna substrate. The through-silicon via and a radio frequency integrated circuit is coupled to a plurality of antenna elements disposed on the phased-array antenna substrate where each of the plurality of antenna elements is coupled to the through-silicon vias and radio frequency integrated circuit through a plurality of through-silicon vias. A process of assembling the through-silicon vias and radio frequency integrated circuit to the phased-array antenna substrate includes testing the apparatus.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully