Thin film stack with surface-conditioning buffer layers and related methods
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United States of America Patent
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Aug 26, 2014
Grant Date -
Feb 6, 2014
app pub date -
Aug 2, 2012
filing date -
Aug 2, 2012
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Abstract
This disclosure provides systems, methods and apparatus for a thin film stack with surface-conditioning buffer layers. In one aspect, the thin film stack includes a plurality of thin film layers each having a thickness greater than about 10 nm and a plurality of surface-conditioning buffer layers each having a thickness between about 1 nm and about 10 nm. The surface-conditioning buffer layers are alternatingly disposed between the thin film layers. Each of the surface-conditioning buffer layers are formed with the same or substantially the same thickness and composition. In some implementations, the surface-conditioning buffer layers are formed by atomic layer deposition.
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