Process for preparing an optical interposer for waveguides

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United States of America Patent

PATENT NO 8818144
APP PUB NO 20120189245A1
SERIAL NO

13017668

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A process for preparing a subassembly, the process comprising: (a) defining the location of one or more grooves for receiving optical conduits on the top planar surface of a wafer or panel, the grooves corresponding to multiple interposers on the wafer or panel; and (b) etching the grooves into the wafer or panel, each groove having sidewalls and first and second terminal ends and a first facet at each terminal end perpendicular to the side walls, each first facet having a first angle relative to the top planar surface, each groove being shared by a pair of transmitting and receiving interposers on the wafer or panel prior to being diced such that the first and second terminal ends of each groove correspond to transmitting and receiving interposers, respectively.

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Patent Owner(s)

  • TE CONNECTIVITY CORPORATION;TYCO ELECTRONICS NEDERLAND B.V.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bowen, Terry Patrick Dillsburg, US 24 249
Rietveld, Jan Willem Benschop, NL 36 450

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