Method for producing liquid-ejecting head

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United States of America Patent

PATENT NO 8819935
APP PUB NO 20110308715A1
SERIAL NO

13079287

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method for producing a liquid-ejecting head including a passage-forming substrate and a protective substrate. The passage-forming substrate has pressure-generating chambers communicating with nozzle orifices, piezoelectric devices that change the inner pressures of the pressure-generating chambers, and liquid supply channels for supplying the pressure-generating chambers. The protective substrate has a piezoelectric-device accommodating portion and a through-hole, through which wirings to lead electrodes extended from the piezoelectric devices pass thorough. The method includes forming the piezoelectric-device accommodating portion and a portion of the through-hole in the protective substrate while leaving a lid, a portion of the protective substrate, closing off an opening of the through-hole, bonding the protective substrate to the passage-forming substrate, forming the pressure-generating chambers and the liquid supply channels in the passage-forming substrate, forming a protective film on surfaces of the passage-forming substrate and the protective substrate, and removing the lid to complete the formation of the through-hole.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Seiichi Shiojiri, JP 8 48
Yamazaki, Yutaka Chino, JP 37 225

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