Microfluidic device having improved epoxy layer adhesion

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United States of America Patent

PATENT NO 8820883
APP PUB NO 20130002753A1
SERIAL NO

13170693

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Abstract

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A microfluidic device includes a substrate; at least one inorganic layer provided on the substrate; a patterned epoxy layer formed over the at least one inorganic layer, the patterned epoxy layer including a wall that defines a location for a fluid in the microfluidic device; and an alkoxysilane material containing a primary or secondary amine for promoting adhesion between the at least one inorganic layer and the patterned epoxy layer.

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Patent Owner(s)

  • EASTMAN KODAK COMPANY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huffman, James D Pittsford, US 54 1932
Lebens, John A Rush, US 105 2228
McCovick, Robert E Hilton, US 15 100
Wang, Yongcai Webster, US 197 1457
Zhang, Weibin Pittsford, US 37 78

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