Liquid ejecting head, liquid ejecting apparatus, piezoelectric element, and method for manufacturing the same

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United States of America Patent

PATENT NO 8820894
APP PUB NO 20130250006A1
SERIAL NO

13848465

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Abstract

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A liquid ejecting head is provided with a piezoelectric element having a piezoelectric layer and a first electrode and a second electrode provided on the piezoelectric layer, in which the piezoelectric layer contains a buffer layer provided on the first electrode and having a perovskite structure containing bismuth, iron, and at least one of zinc and nickel and a complex oxide layer provided on the buffer layer and having a perovskite structure containing bismuth, iron, barium, and titanium.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakai, Tomohiro Chino, JP 87 356

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