Rapid thermal processing systems and methods for treating microelectronic substrates

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United States of America Patent

PATENT NO 8822877
APP PUB NO 20130233834A1
SERIAL NO

13868886

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Abstract

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Rapid thermal processing systems and associated methods are disclosed herein. In one embodiment, a method for heating a microelectronic substrate include generating a plasma, applying the generated plasma to a surface of the microelectronic substrate, and raising a temperature of the microelectronic substrate with the generated plasma applied to the surface of the microelectronic substrate. The method further includes continuing to apply the generated plasma until the microelectronic substrate reaches a desired temperature.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Qin, Shu Boise, US 51 694

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